MediaTek unveiled the Dimensity 6300, its newest mid-range chipset. This successor to the Dimensity 6100+ boasts a faster main CPU cluster. The Cortex-A76 cores are now overclocked to 2.4 GHz, up from 2.2 GHz. It also packs 6x Cortex-A55 cores clocked at 2GHz.

Built on TSMC’s 6nm process, the Dimensity 6300 integrates a Mali-G57 MC2 GPU. MediaTek promises a 10% CPU performance improvement compared to its predecessor.

The Dimensity 6300 incorporates MediaTek UltraSave 3.0+ technology for power efficiency and an integrated 5G modem compatible with the 3GPP Release 16 standard.

While it maintains support for LPDDR4x RAM and UFS 2.2 storage like its predecessor, the new chip can now drive displays up to a resolution of 1080 x 2520 pixels. It also supports high-resolution cameras up to 108MP, dual-band Wi-Fi 5 (a/b/g/n/ac), and Bluetooth 5.2 connectivity.

The realme C65 5G is expected to be the first smartphone to launch later this month powered by the Dimensity 6300.